Motorola CPCI-6115 Manuel de service Page 77
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7
CPX8216 and CPX8216T Installation and Use (6806800A52C)
57
7 Installing Boards in the Chassis
Before You Install or Remove a Board
Boards may be damaged if improperly installed or handled. Please read and follow the
guidelines in this section to protect your equipment.
Observe ESD Precautions
Use ESD
Wrist Strap
ESD
Emerson strongly recommends that you use an antistatic wrist strap and a conductive
foam pad when installing or upgrading a system. Electronic components, such as disk
drives, computer boards, and memory modules, can be extremely sensitive to
electrostatic discharge (ESD). After removing the component from its protective
wrapper or from the system, place the component flat on a grounded, static-free
surface (and, in the case of a board, component side up). Do not slide the component
over any surface.
If an ESD station is not available, you can avoid damage resulting from ESD by wearing
an antistatic wrist strap (available at electronics stores) that is attached to an active
electrical ground. Note that a system chassis may not be grounded if it is unplugged.
Watch for Bent Pins or Other Damage
!
Caution
Caution
Bent pins or loose components can cause damage to the board, the backplane, or
other system components. Carefully inspect your board and the backplane for both pin
and component integrity before installation.
ECC and our suppliers take significant steps to ensure there are no bent pins on the backplane
or connector damage to the boards prior to leaving our factory. Bent pins caused by improper
installation or by boards with damaged connectors could void the Emerson warranty for the
backplane or boards.
If a system contains one or more crushed pins, power off the system and contact your local
sales representative to schedule delivery of a replacement chassis assembly.
Use Caution When Installing or Removing Boards
When first installing boards in an empty chassis, we recommend that you start at the left of the
card cage and work to the right when cards are vertically aligned; in horizontally aligned cages,
work from bottom to top.
- CPX8216 and CPX8216T 1
- Trademarks 2
- Contact Address 2
- Safety Summary 3
- Flammability 4
- EMI Caution 4
- FCC Class A 5
- Industrie Canada 5
- WEEE Compliance 5
- Contents 12
- List of Figures 13
- List of Tables 15
- About This Manual 17
- Summary of Changes 18
- Comments and Suggestions 18
- Introduction 21
- Chapter 1 Introduction 22
- System Architecture 23
- Platform Layout 24
- CPX8216 Standard Layout 25
- CPX8216T (H.110) Layout 26
- Bus Access and Control 27
- Hot Swap Controller 28
- The Simplex Configuration 29
- I/O Domain A I/O Domain B 30
- Active CPU Active HSC 30
- I/O Configurations 31
- CPU Complex Architecture 32
- Staged Pins 33
- The Hot Swap Process 34
- Physical 34
- Hardware 34
- Software 34
- Physical Connection Process 35
- Hardware Connection Process 35
- Software Connection Process 35
- Hardware Resources 36
- Device Drivers 36
- Platform Description 37
- Figure 3-2. CPX8216 Rear View 38
- Front Slots 39
- Rear Slots - RTM 39
- PRIMARY SIDE 40
- H. 110 Bus 41
- CompactPCI Bus 41
- System Slot 41
- HSC Slot 41
- Power/Fan Modules 43
- Power Distribution Panel 44
- Drive Modules 46
- Site Preparation 47
- Power Requirements 48
- Power Circuit Protection 49
- Cable Planning 50
- Environmental Considerations 51
- Chapter 4 Site Preparation 52
- Chassis Installation 53
- Mounting Hole Locations 54
- SIDE VIEW FRONT VIEW 56
- TOP VIEW 56
- Warni ng 57
- Rack/Cabinet 59
- Connecting the Chassis Cables 60
- -48 VDC RTN 60
- Connecting a SCSI Cable 61
- Connecting a Serial Console 62
- Chassis Operations 65
- Emergency Power-Off Procedure 66
- Controls and Indicators 66
- Input Power Rocker Switch 67
- Indicators 67
- System Status Indicators 67
- MINOR MAJOR CRITICAL 68
- LED Color 69
- Out of Service Red 69
- In Service Green 69
- Power Supply/Fan Indicators 70
- Keyswitch 71
- Out-of-Service 71
- In-Service 71
- Drive Activity 71
- 2963 0601 72
- Chassis Cooling 73
- 4244 1103 74
- Air Intake 74
- Cooling Monitoring 75
- Power Monitoring 75
- Chapter 6 Chassis Operations 76
- Observe ESD Precautions 77
- Preserve EMI Compliance 78
- Understand Hot Swap 78
- 4243 1103 79
- Installing a Module 80
- Removing a Hot-Swap Module 81
- 4322 0804 82
- MCP750 TMCP700 84
- BACKPLANE 84
- Overview of Carrier Frames 86
- Hot Swap IDE Drives 87
- 4084 0302 89
- 2422 9811 91
- Red Cable Select 4 92
- Ye l l o w S l a v e 3 92
- Green Master 2 92
- 2447 9812 93
- Hot Swap SCSI Drives 94
- 2448 9812 95
- CPUs A and B 95
- (Default) 95
- 2417 9811 96
- 2418 9811 98
- Drive Activity Cable Detail 99
- 4272 0404 100
- 2446 9812 101
- Non-Hot Swap Drive Modules 102
- 2414 9811 103
- Drive Configuration 104
- 2420 9811 106
- Removing a 5.25-inch Drive 107
- 2415 9811 108
- Replacing a Floppy Drive 110
- 2445 9812 111
- Overview 113
- Removal 114
- Installation 115
- Fan Module Replacement 115
- Alarm Panel 116
- Installing the Floppy Housing 118
- Pin Assignments 121
- Chapter 10 Pin Assignments 122
- CPX8216 standard backplane 133
- Transition Module Slots 140
- (Transition Slots 7 and 9) 145
- Remote Alarm Connector (J1) 150
- Drive Connectors 150
- IDE Drive (IDEA and IDEB) 151
- Specifications 153
- Appendix A Specifications 154
- Systeminstallationsanleitung 159
- Kühlen des Gehäuses 160
- ESE und Sicherheit 160
- Anschließen des Systems 162
- Einschalten des Netzstroms 162
- Related Documentation 165
- Related Specifications 166
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