Motorola CPCI-6115 Manuel de service Page 78

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CPX8216 and CPX8216T Installation and Use (6806800A52C)
Chapter 7 Installing Boards in the Chassis
58
When inserting or removing a board in a slot adjacent to other boards, use extra caution to avoid
damage to the pins and components located on the primary or secondary sides of the boards.
Preserve EMI Compliance
!
Caution
Caution
To preserve compliance with applicable standards and regulations for electromagnetic
interference (EMI), during operation all front and rear openings on the chassis or board
faceplates must be filled with an appropriate card or covered with a filler panel. If the
EMI barrier is open, devices may cause or be susceptible to excessive interference.
Understand Hot Swap
!
Caution
Caution
Inserting or removing non-hot swap cards or transition modules with power applied
may result in damage to module components. Make sure that your board manufacturer
identifies your module as hot swap ready.
The PICMG 2.1 Hot Swap specification defines varying levels of hot swap. A board that is
compliant with the specification can be inserted and removed safely with system power on
without damage to on-board circuitry. If a module is not hot swap compliant, you should remove
power to the slot or system before inserting or removing the module.
To facilitate hot swap, PICMG 2.1 specifies a blue LED on the faceplate. This LED is under
software control.
If your system is using software that provides full hot swap capabilities, the software will
illuminate the blue hot swap LED on the faceplate when software has stopped and it is safe to
remove the board.
If your system does not have hot swap-aware software running, behavior of the blue LED may
be indeterminate. In this case, you may need to manually shut down applications or operating
systems running on the board prior to board removal, even if the blue LED is lit.
!
Caution
Caution
Powering down or removing a board before the operating system or other software
running on the board has been properly shut down may cause corruption of data or
file systems.
Refer to the documents listed in Appendix C, Related Documentation for more information
about hot swap and the PCI Industrial Computer Manufacturers Group (PICMG) Hot Swap
Specification.
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