Motorola CPCI-6115 Manuel de service Page 86
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CPX8216 and CPX8216T Installation and Use (6806800A52C)
Chapter 8 Drive Removal and Installation
66
These procedures for working with hot swap drive modules are covered in the next several
sections. Please read this information before attempting to replace your drives.
■ Overview of Carrier Frames
■ Hot Swap IDE Drives
■ Hot Swap SCSI Drives
Overview of Carrier Frames
The carrier frame provides the connectivity between the hot swap drive carrier and the system.
There are two types of drive carrier frames, one for SCSI carriers and another for IDE carriers.
The carrier frame remains in the chassis when a drive module is hot swapped. It is not removed
as part of the hot swap operation.
Removing a Carrier Frame
You need to shut down the operating system and remove the input power before performing
these procedures. The carrier frame is not hot swappable. Refer to the illustration on the next
page and follow these steps to remove either an IDE or SCSI carrier frame from your chassis.
1. Shut down the system and power off the chassis.
2. Remove the floppy housing from the rear of the chassis. Refer to Floppy Housing Removal and
Installation on page 98.
3. Detach the signal, power, and SCSI or IDE cables from the rear of the drive carrier frame being
removed.
If not replacing another drive at this time, replace the floppy bay, otherwise leave it off for access
to the cables during drive installation.
4. Remove the drive module from the drive frame:
■ Push in the switch key and turn the key counterclockwise 1/4 turn. This unlatches the drive
carrier unit from the frame, freeing it for removal
■ Pull the drive module unit straight out of the chassis
5. Remove the front drive bay bezel (loosen the four captive screws in the corners of the bezel and
pull the bezel straight from the chassis).
6. Remove the two retaining screws from the top and bottom of the drive carrier frame.
7. Pull the drive carrier frame straight out of the drive bay.
If not installing another drive module at this time, fill the drive bay with an unpopulated standard
drive carrier or filler panel.
- CPX8216 and CPX8216T 1
- Trademarks 2
- Contact Address 2
- Safety Summary 3
- Flammability 4
- EMI Caution 4
- FCC Class A 5
- Industrie Canada 5
- WEEE Compliance 5
- Contents 12
- List of Figures 13
- List of Tables 15
- About This Manual 17
- Summary of Changes 18
- Comments and Suggestions 18
- Introduction 21
- Chapter 1 Introduction 22
- System Architecture 23
- Platform Layout 24
- CPX8216 Standard Layout 25
- CPX8216T (H.110) Layout 26
- Bus Access and Control 27
- Hot Swap Controller 28
- The Simplex Configuration 29
- I/O Domain A I/O Domain B 30
- Active CPU Active HSC 30
- I/O Configurations 31
- CPU Complex Architecture 32
- Staged Pins 33
- The Hot Swap Process 34
- Physical 34
- Hardware 34
- Software 34
- Physical Connection Process 35
- Hardware Connection Process 35
- Software Connection Process 35
- Hardware Resources 36
- Device Drivers 36
- Platform Description 37
- Figure 3-2. CPX8216 Rear View 38
- Front Slots 39
- Rear Slots - RTM 39
- PRIMARY SIDE 40
- H. 110 Bus 41
- CompactPCI Bus 41
- System Slot 41
- HSC Slot 41
- Power/Fan Modules 43
- Power Distribution Panel 44
- Drive Modules 46
- Site Preparation 47
- Power Requirements 48
- Power Circuit Protection 49
- Cable Planning 50
- Environmental Considerations 51
- Chapter 4 Site Preparation 52
- Chassis Installation 53
- Mounting Hole Locations 54
- SIDE VIEW FRONT VIEW 56
- TOP VIEW 56
- Warni ng 57
- Rack/Cabinet 59
- Connecting the Chassis Cables 60
- -48 VDC RTN 60
- Connecting a SCSI Cable 61
- Connecting a Serial Console 62
- Chassis Operations 65
- Emergency Power-Off Procedure 66
- Controls and Indicators 66
- Input Power Rocker Switch 67
- Indicators 67
- System Status Indicators 67
- MINOR MAJOR CRITICAL 68
- LED Color 69
- Out of Service Red 69
- In Service Green 69
- Power Supply/Fan Indicators 70
- Keyswitch 71
- Out-of-Service 71
- In-Service 71
- Drive Activity 71
- 2963 0601 72
- Chassis Cooling 73
- 4244 1103 74
- Air Intake 74
- Cooling Monitoring 75
- Power Monitoring 75
- Chapter 6 Chassis Operations 76
- Observe ESD Precautions 77
- Preserve EMI Compliance 78
- Understand Hot Swap 78
- 4243 1103 79
- Installing a Module 80
- Removing a Hot-Swap Module 81
- 4322 0804 82
- MCP750 TMCP700 84
- BACKPLANE 84
- Overview of Carrier Frames 86
- Hot Swap IDE Drives 87
- 4084 0302 89
- 2422 9811 91
- Red Cable Select 4 92
- Ye l l o w S l a v e 3 92
- Green Master 2 92
- 2447 9812 93
- Hot Swap SCSI Drives 94
- 2448 9812 95
- CPUs A and B 95
- (Default) 95
- 2417 9811 96
- 2418 9811 98
- Drive Activity Cable Detail 99
- 4272 0404 100
- 2446 9812 101
- Non-Hot Swap Drive Modules 102
- 2414 9811 103
- Drive Configuration 104
- 2420 9811 106
- Removing a 5.25-inch Drive 107
- 2415 9811 108
- Replacing a Floppy Drive 110
- 2445 9812 111
- Overview 113
- Removal 114
- Installation 115
- Fan Module Replacement 115
- Alarm Panel 116
- Installing the Floppy Housing 118
- Pin Assignments 121
- Chapter 10 Pin Assignments 122
- CPX8216 standard backplane 133
- Transition Module Slots 140
- (Transition Slots 7 and 9) 145
- Remote Alarm Connector (J1) 150
- Drive Connectors 150
- IDE Drive (IDEA and IDEB) 151
- Specifications 153
- Appendix A Specifications 154
- Systeminstallationsanleitung 159
- Kühlen des Gehäuses 160
- ESE und Sicherheit 160
- Anschließen des Systems 162
- Einschalten des Netzstroms 162
- Related Documentation 165
- Related Specifications 166
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