Motorola M68CPU32BUG Manuel d'utilisateur Page 11

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HARDWARE PREPARATION AND INSTALLATION
M68332BCC/D 2-1 MOTOROLA
REV 1
CHAPTER 2
HARDWARE PREPARATION AND INSTALLATION
2.1 INTRODUCTION
This chapter provides unpacking instructions, hardware preparation, and installation instructions
for the BCC prior to target system installation. This description ensures the BCC is properly
configured for target system operation.
2.2 UNPACKING INSTRUCTIONS
Unpack the BCC from shipping carton. Refer to the packing list and verify that all items are
present. Save packing material for storing and shipping the BCC.
NOTE
If the product arrives damaged, save all packing material, and contact the
carrier’s agent.
2.3 HARDWARE PREPARATION
This portion of text describes the inspection and preparation of the BCC prior to installation and
ensures the proper configuration for target system operation. The BCC was factory tested and
shipped with factory-installed jumpers (Figure 2-1 shows jumper header and connector
locations). These jumper headers allow the user to customize BCC functionality. Table 2-1 is a
description of the BCC jumper header types, and Table 2-2 is a summary of the BCC jumper
headers.
CAUTIONS
Use caution when handling the BCC; the signals are not buffered so the BCC
is sensitive to static discharge.
Depending on the application, it may be necessary to cut wiring trace shorts
(cut-trace shorts) on the PCB. Be careful not to cut adjacent PCB wiring
traces.
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