Motorola AT Commands G24-LC Informations techniques Page 103

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Chapter 4: Mechanical Specifications
December 15, 2009 G30 - Module Hardware Description 79
Layout Recommendation
Note: This section applies to G30 LGA Model only.
Soldering Footprint
Figure 4-9 gives a layout recommendation for the G30.
Figure 4-9: G30 Soldering Footprint (Top View)
Note:
Routing signals other then GND (Ground) within inner soldering footprint area of G30
(under G30) is not recommended.
Vias inside pads are not recommended.
Verify GND pads are well tied to ground plane layer by vias.
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